NearStack 100 ohm high-speed cable assembly
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NearStack 100 ohm high-speed cable assembly
Update time：2021-08-25 Pageviews：636
Molex expands product line of innovative NearStack high-speed cable solutions
With the development of high-speed and high-density applications, the traditional circuit board design is withdrawing from the stage and being replaced by lower-cost high-speed products. The NearStack solution optimizes signal integrity channel performance by using direct-connect, circuit board bypass circuits, and lower loss materials. In addition, the NearStack solution removes the re-timer and other active components from the high-speed channel, and reduces expensive printed circuit board materials, thereby reducing costs.
With the continuous development of system requirements, the length of the signal channel has also continued to extend, and related tasks have become more and more challenging-the existing solutions in the field of standard printed circuit boards will pose a challenge to clear signal transmission, and the cost It will be too high. In order to meet these challenges, Molex launched the NearStack solution.
Molex's complete data center solutions target scalability, provide high-speed support, optimize signal integrity, shield electromagnetic interference, and have extremely high thermal efficiency. Through close cooperation with industry-leading technology companies, Molex focuses on providing good support for customer applications that meet the 112Gbps speed requirements and planning for the needs of the next generation.
With the development of high-speed and high-density applications, the traditional circuit board design is withdrawing from the stage and being replaced by lower-cost high-speed products. The NearStack solution optimizes signal integrity channel performance by using direct-connect, circuit board bypass circuits, and lower loss materials. In addition, the NearStack solution removes the re-timer and other active components from the high-speed channel, and reduces expensive printed circuit board materials, thereby reducing costs.
With the continuous development of system requirements, the length of the signal channel has also continued to extend, and related tasks have become more and more challenging-the existing solutions in the field of standard printed circuit boards will pose a challenge to clear signal transmission, and the cost It will be too high. In order to meet these challenges, Molex launched the NearStack solution.
Molex's complete data center solutions target scalability, provide high-speed support, optimize signal integrity, shield electromagnetic interference, and have extremely high thermal efficiency. Through close cooperation with industry-leading technology companies, Molex focuses on providing good support for customer applications that meet the 112Gbps speed requirements and planning for the needs of the next generation.
NearStack 100 ohm products are ideal for 100 ohm impedance applications. The design uses a small package, supports 56 Gbps PAM-4, and is compatible with Molex's BiPass I/O. The solution uses 34 AWG dual coaxial cables, which can realize high-speed crimping jumper products under the size of 8 differential pairs and 16 differential pairs.
